The function and maintenance of SMT Stencil

Materials
27 Oct

SMT Stencil is a special mold for SMT. Its main function is to help the deposition of solder paste. The purpose is to transfer the accurate amount of solder paste to the accurate position on the empty PCB. The SMT stencil plays an important role and affects The quality of patch processing.

In the process of SMT patch production, due to PCB circuit board deformation, inaccurate positioning, insufficient support or design and other other problems.
During solder paste printing, it is difficult to form an ideal sealing state between the stencil and the pads of the circuit board. During the SMT production process, solder paste may sometimes squeeze out of the gap between the stencil and the circuit board. and remain at the bottom of the steel mesh.

If this solder paste is not cleaned in time, it will affect the surface cleaning of the circuit board during the subsequent STM patching process. Stencil wipes are needed to clean the remaining solder paste at the bottom of the stencil.

KangHongJin products are made from high-quality materials and designed to be easy to use, ensuring that our customers can improve efficiency and accuracy in their assembly processes.